In camera modules, MEMS devices, and chip-scale packaging, dispensing precision is measured in microns. A positional deviation of a single droplet, a string of residue, or a trapped bubble can compromise the final performance of the device.
The Auto Glue Dispenser with Dual-Module Four Valves XY-1240TM delivers a minimum dot diameter of just 80 μm. Its built‑in high‑speed signal‑response circuit in the syringe valve controller continuously detects dispensing signals and ejection pressure, ensuring consistent output. The automatic vacuum suck‑back function effectively prevents stringing, dripping, and bubble entrapment. With multi‑channel storage for dispensing parameters, the system allows rapid switching between different paste viscosities – whether solder paste, red epoxy, or UV adhesive – making it ideal for diverse production runs.
Where is it used? Widely applied in optical modules, semiconductors, consumer electronics, automotive electronics, and medical/life sciences – anywhere that demands ultra‑precision manufacturing.
The CCD Visual Glue Dispensing Machine XY-QE400 achieves placement accuracy of 40 μm. Its dual‑drive linear‑motor stage reaches a maximum XY speed of 2,000 mm/s, delivering stable dot diameters of φ0.23 mm with Type 6 powder and φ0.18 mm with Type 7 powder. Jetting productivity peaks at 1,000,000 dots per hour. Gerber offline programming cuts the time from CAD file to first article to just 30 minutes. The process requires no nozzle wiping during production, and the quick‑release structure enables a 5‑minute changeover.
Where is it used? Semiconductor packaging, Mini‑LED, consumer electronics and display modules, camera modules – any high‑volume, high‑density solder‑paste jetting process can count on this solution.
Beyond stand‑alone machines – we speak the language of integrated lines.
In real‑world production, the synergy across printing, ball placement, inspection, and rework is what determines yield and efficiency at scale.
XH Fully Automatic Wafer‑Level Bumping Line
Key features:
-
Five integrated modules – printing, bumping, wafer handling, AOI inspection, and repair – form a closed‑loop intelligent manufacturing cell.
-
XH’s proprietary Cyclone non‑contact bumping technology ensures gentle, damage‑free wafer transfer, while AOI vision and automatic repair provide closed‑loop quality control.
-
Fully unmanned operation with full data traceability, covering the entire wafer‑level packaging landscape for 60–300 μm WLCSP bumping processes.
-
Primary applications: Fan‑Out WLCSP, Fan‑in WLCSP, Flip‑Chip, TSV, and other wafer‑level packaging schemes.
XH Fully Automatic Substrate‑Level Micro‑Ball Bumping Solution
Key features:
-
Four core modules – precision printing, micro‑ball placement, inline inspection, and intelligent repair – work seamlessly together.
-
High‑accuracy printing ensures consistent solder paste deposition, while micro‑ball placement is executed with pinpoint precision. AOI vision paired with automatic ball‑repair achieves closed‑loop quality assurance.
-
Fully automatic in‑line flow, requiring no manual intervention, effectively handles substrate warpage and micro‑ball diameters from 60 to 300 μm – driving yield improvement in advanced packaging.
-
Primary applications: substrate (strip) formats, FCBGA, SiP, PoP, CSP, and 2.5D/3D packaging.
Over the three‑day exhibition, the xinhua intelligent booth welcomed both long‑time partners and new faces from around the world. Some stopped for deep technical discussions, others came with specific process challenges seeking solutions, and many remarked, "China‑made packaging equipment has truly come of age."
As we shift our gaze from the show floor back to the chip itself – the one that may sit inside your smartphone, keeping you connected to the world; the one that powers high‑performance computing, feeding AI and big data with raw processing strength; the one embedded in autonomous driving controllers, safeguarding every journey; or the one implanted in medical devices, protecting lives – chips are everywhere. And behind every reliable chip lies the unwavering pursuit of excellence in packaging technology.
