PCB glue dispensing machine is an automated device designed to precisely dispense adhesives onto printed circuit boards (PCBs) during electronic assembly. These machines enhance bonding quality and reliability of components by delivering accurate, controlled glue amounts, improving production efficiency while minimizing waste and errors.
Key features and capabilities include:
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Precision dispensing: Accuracy typically around ±0.01 to ±0.02 mm, enabling precise glue placement on small and complex PCB areas.
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Versatile dispensing modes: Options for needle dispensing or non-contact spray/jet valve dispensing, suitable for various glue types including epoxy, UV glue, silicone, acrylic, and conductive adhesives.
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Multi-axis movement and programming: Machines support complex 3D trajectories (points, lines, arcs, curves) for non-planar surfaces and can be programmed via handheld LCD or PC software.
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Vision guidance and sensors: Integration of CCD cameras, laser altimeters, and glue sensors to improve accuracy and automatic alignment during dispensing.
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Anti-clogging and automatic cleaning: Features like anti-curing functions and automatic cleaning systems prevent glue needle blocking and maintain consistent output.
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File storage and smart functions: Memory for multiple dispensing programs, automatic program calling, data statistics, and fool-proofing for efficient manufacturing.
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Application range: Widely used in semiconductor packaging, mobile phones, notebooks, automotive parts, LED dispensing, and conformal coating on PCB assemblies.
| Specification | Typical Values |
|---|---|
| Dispensing range | 400-1200 mm (X), 400 mm (Y), 50 mm (Z) |
| Product size/weight | Max ~4.5 kg, thickness up to 6 mm |
| Dispensing speed | Up to 2000 mm/s |
| Dispensing accuracy | ±0.02 mm (accuracy), ±0.01 mm repeatability |
| Material compatibility | Epoxy, UV glue, silicone, acrylic, conductive adhesives |
| Weight and dimensions | 650-950 kg; footprint varies by model |